Advanced Process Systems, Inc                                                                                                                                                                                                    

   MECO EQUIPMENT ENGINEERS             GNP TECHNOLOGY             SRI INTERNATIONAL    

 

 
 Home Page  I  Equipment & Manufacture Links  I  R&D Equipment  I  R&D Contract Fab  I  Process Papers   I   About Us  I  Contact Us
      
 
ED Photo-Resist Coaters                                                                                                                                              
 

   Electroless UBM Systems

    Electroless Under Bump Metallization.pdf

 

        MECO
  CMP Systems

   Introduction to GnP Systems.pdf

   R&D CMP Vs Production CMP.pdf

   Chemical Mechanical Planarization.pdf

 

   International Conference on Planarization / CMP Technology, Posters:

   Effects of Abrasive and Complexing Agent on Uniformity in Cu CMP

   Correlation of Pad Surface Roughness and Material Removal Behavior

   Wireless AE for Condition Monitoring in Copper CMP

 
          
  Contract FAB Services

   Introduction to SRI International

   R&D Contract Fab Services.pdf

           
 
             
   

 

 

 
                                  

Advanced Process Systems is committed to providing next generation manufacturing equipment for product development through full production in the semiconductor development areas of MEMS, WLP, MCM, 3-D development, compound semiconductor, electroless under bump metallization  and many diverse areas of advanced packaging. Representing cost effective equipment for R&D through production in the manufacturing areas of Chemical Mechanical Planarization (CMP), Electroless Under Bump Metallization (Electroless UBM) and Electrodeposition of Photoresist (ED Photoresist). With our third generation ED Photoresist Coater system the  electrodeposition of photoresist is an enabling technology for 3-D advanced packaging applications and next generation development. Our R&D Contract Fab for MEMS, optoelectronics, and 3-D advanced packaging provides the most multi-disciplinary staff of scientist, engineers, and physicist of any R&D contract Fab in the United States.