Dual Head
Chemical Mechanical Planarization
with
Friction Force Statistical Process
Control
for 4”, 6”, & 8”
Wafers
and
R&D Coupons.
GnP Technology
works in partnership
with Berkeley
University Mechanical Engineering dept for demos and samples.
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Friction
Force Monitoring System
For in-situ Chemical
Mechanical Planarization process Analysis.
Advanced R&D
Development from basic CMP to Nano level CMP
Quick Analysis of
Metals and Metal Layer Selection
Advanced
Process Systems is committed to providing next generation
manufacturing equipment for product development
through full production in the semiconductor development areas of MEMS, WLP, MCM, 3-D
development, compound
semiconductor and many diverse areas of advanced packaging. Representing cost effective equipment for R&D through
production
in the manufacturing areas of post (CMP) Wafer Cleaner
Systems, Chemical Mechanical Planarization (CMP),
Electroless
Under Bump Metallization (Electroless UBM) and Electro-deposition of Photoresist (ED
Photo resist Coater).
Our 3rd generation ED Photo resist
Wafer Coaters for Electrodeposition
of Photoresist is an enabling technology for 3D
advanced packaging applications and next generation development. Our R&D
Contract Fab for MEMS, optoelectronics,
and 3-D
advanced packaging development provides the most multi-disciplinary staff of scientist,
engineers and physicist
of any
R&D contract Fab in the United States.
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