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GnP Technology
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POLI-400 4" & 6"
R&D and Pre-Production
(CMP)
Quick change-over
heads for Si, Ox, Metals
Chemical Mechanical Planarization
GnP CLEANER 428
GnP Cleaner 428, Post CMP
Wafer 0 Cleaning
and Fab Wafer Cleaner for
0
100mm, 150mm and 200mm Wafers
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GnP POLI-762
8" & 12"
G&P 300MM Chemical Mechanical Panarization |
Advanced Process
Systems is committed to providing next generation manufacturing
equipment for product development through full production in the
semiconductor development areas of MEMS, WLP, MCM, 3-D
Development, Compound Semiconductor, Electroless Under Bump
Metallization, Chemical Mechanical Planarization and many diverse
areas of advanced packaging. Representing cost effective equipment
for R&D through production in the manufacturing areas of post Chemical Mechanical Planarization
Wafer Cleaning, Chemical Mechanical Planarization (CMP), Electroless Under Bump Metallization (Electroless UBM) and
Electrodeposition of Photoresist (ED Photoresist Coater). With our
third generation ED Photoresist Coater systems the
Electrodeposition of Photoresist is an enabling technology for 3-D
advanced packaging applications and next generation development. Our
R&D Contract Fab for MEMS, Optoelectronics and 3-D
Advanced Packaging provides the most multi-disciplinary
staff of scientist, engineers, and physicist of any R&D
Contract Fab in the United States. We provide ED Photoresist Coater, Chemical Mechanical Planarization,
(WEP) Wafer Plating and Electroless Under
Bump Metallization samples and Electroless UBM process
qualifications development.
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