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Advanced Process Systems, a
manufacturers representative provides
marketing and business development in North
America and Canada specializing in next generation manufacturing
equipment for product development through
full production in the semiconductor
development areas of MEMS, WLP, MCM, 3-D
advanced packaging, compound semiconductor, electroless
under bump metallization and many
diverse areas of advanced packaging with
Chemical Mechanical Planarization (CMP),
Post Chemical Mechanical Planarization Cleaners, Electroless Under Bump Metallization (Electroless
UBM), Electrodeposition of Metals and Electrodeposition of Photoresist
(3D-ED Photoresist). With Meco's third
generation ED Photoresist wafer coater the electrodeposition of photoresist
is an enabling technology for 3-D advanced
packaging applications. GnP Technology's CMP systems with Friction
Force Measurement System provides in-situ
analysis for R&D and pre-production CMP. SRI
International's new R&D Contract Fab for MEMS,
Optoelectronics, and 3-D
advanced packaging development provides the
most multi-disciplinary staff of scientist,
engineers, and physicist of any independent
R&D contract Fab in the United States.
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