The MicroSystems Engineering Center at SRI International has
completed construction
of
the new
Research & Development Fabrication Center for MEMS,
Optoelectronics,
3-D Advanced Packaging Development.
The R&D Center utilizes 3-D Photoresist Coater and DRIE
among many other specialized systems for 3-D development.
info@apsinc-us.com
_____________________________________________________________________
APSI
Microstructures Center
Research & Development Contract Service
APSI Microstructures Center provides
advanced micro-systems process development and device development. Process technology ranges from micro sensors, hermetic MEMS
caps to high gigahertz RF MEMS filters. Consulting on process and device
development from initial R&D stages through production cost analysis is provided. Wafer process equipment handles up to 150mm wafers. Plating and
Lithography equipment handles up to150mm wafers with process and
lithography for square and non-standard size substrates provided. Process technology for high topography
and deep cavity structures is provided.
