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ChipScale Review
Aug-Sep / Advances in Photo Resist 3-D Deposition & Pattering
Advanced
Process Systems, is committed to providing next generation
manufacturing equipment for product development through full production in the semiconductor development areas of MEMS, WLP, MCM, 3-D
development, compound semiconductor and many
diverse areas of advanced packaging. Representing cost effective equipment for R&D
through production in the manufacturing areas
of Chemical Mechanical Planarization (CMP), Electroless Under Bump Metallization (Electroless
UBM) and Electrodeposition of PhotoResist (3-D ED PhotoResist). Our
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advanced packaging provides the most
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